Next Generation Electronic Assembly Materials
SunRay Scientific’s ZTACH® ACE and ZMAG® Magnetic Pallet Interconnect Solution is a pressure-less, pattern-less Z-axis, conductive adhesive technology for fine-feature assembly on existing SMT manufacturing lines.
ZTACH® ACE and ZMAG® Magnetic Pallet Interconnect Solution
Traditional Interconnect Solutions
Have low bond strength, require patterning, are brittle/inflexible, require higher process temps and longer process times, require secondary materials like encapsulation or underfill, extremely high conductive particle loading, and have constricted throughput.
The ZTACH®ACE Interconnect Solution
Enabled by the innovation of our ZMAG® Magnetic Pallet, ZTACH® ACE achieves z-axis particle alignment within 10 seconds to create an anisotropic electrical and mechanical bond between component and circuit. This technology enables the ability to displace traditional electrical interconnect solutions with greater performance and reliability.
Technology Advantages
Fine-pitch interconnections down to 100μm
- 5-10x increase in bond strength
- No patterning or pressure required
- Reduced cost through low conductive particle loading
- Contact resistance between 7-20 mOh-cm
- Low temperature and UV cure options
- Broad substrate compatibility
- Easily adaptable into most SMT manufacturing lines
Advanced Engineering Services
- Manufacturing process development to help you integrate ZTACH® ACE into your products and process
- Rapid prototype development
- Custom materials development to support your unique needs
Our Complementary Technologies
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Our unique manufacturing process and proprietary additive technology have led to the development of an innovative family of conductive silver-based inks which achieve much lower conductivity with less silver content, while drastically reducing oxide formation and the silver migration that stems from it. This results in: creased conductivity with less silver content.
Conductive Silver Inks
- Improved mechanical and environmental stability
- Excellent flexibility and stretchability
- Improved conductivity for less cost
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Utilizing the same innovative manufacturing process for our adhesive technology allows SunRay’s electrically conductive epoxies to achieve similar advantages in improved conductivity with much lower silver content. This also allows for dramatically increased adhesion. As a result, we provide a conductive epoxy adhesive with:
Silver Filled Epoxy Adhesive
- 2 -3 x improvement in bond strength
- 10-20% decrease in contact resistance
- Reduced cost
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SunRay Scientific has developed an innovative, fully compatible family of device encapsulation and dielectric protection materials to enable more durable, reliable protection for your printed electronic applications. Our family of dispensable encapsulation materials and printable dielectrics offer:
UV Cured Protective Materials
- Exceptionally flexible encapsulation
- TPU compatible dielectric inks
- Increased dielectric strength and voltage breakdown protection
ZTACH® ACE Value Proposition
Applications
- Flexible Hybrid & Rigid Electronics
- Fine Pitch Bare Die
- High Density LED Interconnects
- Fine Wire & Ribbon Attach
Design Advantages
- Reduced Part Complexity
- Thermal Dissipation
- Self-Underfilling
- Superior Adhesion
- Fine Pitch down to 100 microns
Engineering Benefits
- No Outgassing
- Environmentally Stable
- Rad and Cryogenic Stability
- RF performance up to 90GHz
- Low Temp & UV Cure Options
Manufacturing Benefits
- Anisotropic Without Pressure
- Coplanarity Not Required
- No Patterning
- Improved Yields
- Higher Mfg. Throughput
Current Applications
Medical & Bioelectronic Devices
Design Bioelectronic medical devices using Quick-curing conductive polymers for electrodes, diagnostics, & healthcare electronics.
Automotive Electronics
Support automotive electronics with industrial-grade conductive inks and encapsulation materials.
Sensors & Instrumentation
Achieve long-term stability using high-reliability functional electronic materials optimized for advanced instrumentation applications.
Flexible & Wearable Electronics
Develop wearable electronics ink manufacturers engineered for consistent electrical performance in smart textile applications.
Flexible TPU with LED - Durability Testing
Vision & Mission
SunRay Scientific is a global materials technology company specializing in unique and novel anisotropic conductive adhesive materials, conductive inks, epoxies, and encapsulants.
Our technology innovations enable lighter, smaller, less costly electronics with improved manufacturing throughput & increased reliability. Our mission is to provide our partners with innovative, value-added solutions to meet their complex printed electronics and electrical interconnect needs.
Material Science Insights
What does SunRay Scientific do, and how is it positioned in the advanced materials market?
SunRay Scientific is a U.S.-based advanced materials manufacturer specializing in anisotropic conductive adhesives, conductive inks, silver epoxies, and encapsulants for printed electronics, semiconductor packaging, wearable electronics, and industrial applications. With patented ZTACH® ACE technology and over 20 years of expertise, SunRay Scientific delivers application-ready interconnect solutions that reduce time-to-market for global electronics manufacturers and R&D innovators.
Why is SunRay Scientific attractive to investors and strategic partners?
SunRay Scientific offers a strong investment opportunity due to its patented material science technologies, growing demand in printed electronics and wearable technology markets, scalable manufacturing capabilities, and high-margin custom formulation services. The company operates in rapidly expanding sectors such as IoT devices, automotive electronics, and medical electronics, making it well-positioned for long-term revenue growth and strategic partnerships.
How can investors or partners engage with SunRay Scientific?
Investors and strategic partners can engage with SunRay Scientific by requesting investor documentation, scheduling technical and business briefings, exploring joint development programs, or discussing funding and acquisition opportunities. Interested parties can contact the investor relations team to access growth projections, technology roadmaps, and partnership opportunities.
Advanced materials engineered for real-world applications
SunRay Scientific is a trusted manufacturer of printed electronics materials and functional inks designed for high-performance industrial, medical, automotive, and sensor applications. We specialize in application-ready solutions that help manufacturers accelerate development, reduce time-to-market, and scale production with confidence using precision-engineered conductive and functional materials.
- Advanced printed electronics and material science manufacturing expertise
- Application-driven development for sensors, instrumentation, and smart systems
- Proven quality, reliability, and performance across industrial environments
- Global research partnerships supporting scalable commercial production
Looking for the right material solution for your application?
SunRay Scientific helps manufacturers, engineers, and product teams select and develop advanced printed electronics materials tailored to their exact performance, reliability, and production requirements. From prototyping to commercial-scale manufacturing, our experts support every stage of your materials selection and integration process.
- Expert guidance for printed electronics material selection and system integration
- Fast, reliable technical support for industrial, medical, and sensor applications
- Continuous improvement through feedback and collaboration