Ultra-Fine Pitch Connectivity for Minimalist Wearable Designs.

Inherent problems with Wearable Flexible Hybrid Electronics (FHE)

Durability

Wearable FHE applications are limited due to the difficulty in bonding components for fully hybrid electronics

Cost

The materials needed to bond component into wearable FHEs are costly due to silver loading and need for secondary encapsulation

Manufacturability

For common wearable electronic application, the widely used substrates are woven textiles and TPU which cannot be soldered to, and are hard for other conductive adhesives to bond to

ZTACH® ACE validated value proposition in wearable application:

  • Due to drastically reduced particle loading in ZTACH® ACE, and the anisotropic nature of the electrical interconnection, ZTACH® ACE underfills the entire component only making electrical connection in z-axis. This creates a 5-10x increase in bond strength to the conductive pads and substrate. As a result, ZTACH® ACE holds components to both TPU and textiles with superior mechanical bond and improved environmental stability
  • ZTACH® ACE contains less than 5% silver versus 75-90% of conventional ECAs, and the need for additional layers of underfill or encapsulation are typically eliminated, a process using ZTACH® ACE can reduce the component bond costs from 25-75% depending upon size and number
  • Typical substrates used in wearable electronics like TPU or woven textiles are very difficult to bond components to. Patterning an ECA on Textiles is incredible hard to process due to cure time and temperature, and the bond is very weak. ACP or ACF’s are nearly impossible to use on these surfaces and solder cure temperatures are way too high for TPU and will not work on Textile. ZTACH® ACE eliminates these manufacturing hurdles and give low resistance, high bond strength to both textile and TPU printed circuitry.
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  • Due to drastically reduced particle loading in ZTACH® ACE, and the anisotropic nature of the electrical interconnection, ZTACH® ACE underfills the entire component only making electrical connection in z-axis. This creates a 5-10x increase in bond strength to the conductive pads and substrate. As a result, ZTACH® ACE holds components to both TPU and textiles with superior mechanical bond and improved environmental stability
  • ZTACH® ACE contains less than 5% silver versus 75-90% of conventional ECAs, and the need for additional layers of underfill or encapsulation are typically eliminated, a process using ZTACH® ACE can reduce the component bond costs from 25-75% depending upon size and number
  • Typical substrates used in wearable electronics like TPU or woven textiles are very difficult to bond components to. Patterning an ECA on Textiles is incredible hard to process due to cure time and temperature, and the bond is very weak. ACP or ACF’s are nearly impossible to use on these surfaces and solder cure temperatures are way too high for TPU and will not work on Textile. ZTACH® ACE eliminates these manufacturing hurdles and give low resistance, high bond strength to both textile and TPU printed circuitry.