Medical Device Applications
Precision Interconnects for the Next Generation of Medical Miniaturization.
High-Reliability Material Solutions for Next-Gen Bioelectronics
Ultra-fine wire diameters
Micro-wires in catheters and neurostim leads have extremely small diameters, creating massive hurdles for reliable electrical interconnections.
Our Solution: Our ZTACH® ACE enables sub-micron bonding on ultra-fine pitches, ensuring signal integrity in the smallest medical footprints.
Fatigue and flex reliability issues
Constant flexing of these bioelectronic micro-wires leads to fatigue and bond failure, compromising device longevity and patient safety.
Our Solution: Our flexible conductive inks and encapsulants absorb mechanical stress, providing unmatched durability for wearable and implantable tech.
Traditional methods = complex, failure-prone, high cost
Conventional techniques like laser welding, soldering, and epoxy bonding are complex, error-prone, and costly, leading to manufacturing challenges and delays.
Our Solution: Our low-temp, automated conductive epoxies replace complex bonding, reducing costs and accelerating your time-to-market.
ZTACH® ACE Benefit
Critical assembly processes for high-density, high-performance electronics
- Absorbs misalignment, skew and surface gap of wires with respect to contact pads & substrates, preventing shorting
- Pressure-less attach minimizes wire sweep, bending, breaking or displacement from intended position
- Fine pitch down to 50 microns
- Provides full encapsulation
- Improves surface bond strength
- Encasing wire & sheathing provides strain relief
- No overheating of wire sheathing or metal pad peeling off substrate
- Faster process & greater throughput
In a study using UV ZTACH® ACE for fire pitch wire and sensor attach for continuous glucose monitoring device, we validated the value proposition:
- 80% reduction in mfg. cycle time with UV ZTACH® ACE
- 40%-60% reduction in mfg. space required for UV or Thermal ZTACH® ACE solution
- Increases number of wire or sensor to PCB connections by 2 to 4x within the same space with improved yield (component pitch down to 90 µm)
- Reduction in manufacturing process steps by eliminating need for underfill
- 4x Increase in bond strength
- =/>30% decrease in contact resistance
Empowering the Future of Life-Sustaining Medical & Bioelectronic Devices
Sunray Scientific is the critical link in the medical device supply chain, delivering high-performance conductive inks and encapsulants that thrive where traditional materials fail. We specialize in the miniaturization of bioelectronic devices, offering patented ZTACH® ACA solutions that enable flawless connectivity for neurostim leads, smart catheters, and wearable sensors.
By replacing high-heat soldering with our advanced, low-temperature conductive epoxies, we empower engineers to build smaller, more flexible, and more reliable life-saving technologies.
Partner with Sunray to accelerate your high-yield manufacturing and ensure uncompromising patient safety through superior material science.
Mastering Miniaturization: Advanced Interconnect Solutions for Bioelectronic Systems
As the demand for smaller, smarter medical devices scales, Sunray Scientific provides the essential material toolkit for bioelectronic system integration. We specialize in high-reliability conductive adhesives and moisture-resistant encapsulants that protect sensitive electronics in harsh physiological environments.
Our technology serves as the backbone for MedTech innovators developing next-gen closed-loop neuromodulation, cardiac rhythm management, and real-time diagnostic wearables.
By optimizing the interface between flexible substrates and micro-components, Sunray ensures your medical innovations achieve superior signal-to-noise ratios, long-term biocompatibility, and rapid transition from prototype to high-volume production.
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